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Development of Printed Circuit Heat Exchanger for Hydrogen Station using Diffusion Bonding
Jeong Kil Kim, Deog Nam Shim, Chil Yeong Seon, Ki Hoon Yang, Hae Ji Park, Dong Jin Kim
JWJ. 2017;35(5):57-64.   Published online 2017 September 19    DOI: https://doi.org/10.5781/JWJ.2017.35.5.8

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Development of Printed Circuit Heat Exchanger for Hydrogen Station using Diffusion Bonding
Journal of Welding and Joining. 2017;35(5):57-64   Crossref logo
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High performance printed circuit heat exchanger
Applied Thermal Engineering. 2007;27(10):1702-1707   Crossref logo
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Development of highly effective cryogenic printed circuit heat exchanger (PCHE) with low axial conduction
Cryogenics. 2012;52(7-9):366-374   Crossref logo
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Spray Etching Rate Development of Stainless Steel in the Etchant for Printed Circuit Heat Exchanger Channels
Energy Procedia. 2017;105:4828-4835   Crossref logo
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Development of tritium permeation model for Printed Circuit Heat Exchanger
Annals of Nuclear Energy. 2016;98:166-177   Crossref logo
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The development of a system for measuring material deformation during the bonding of multilayer printed circuit boards
Circuit World. 2002;28(4):11-15   Crossref logo
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Development of an advanced printed circuit heat exchanger analysis code for realistic flow path configurations near header regions
International Journal of Heat and Mass Transfer. 2015;89:242-250   Crossref logo
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Printed circuit heat exchanger thermal–hydraulic performance in supercritical CO2 experimental loop
International Journal of Refrigeration. 2006;29(5):807-814   Crossref logo
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Design analysis of a lead–lithium/supercritical CO2 Printed Circuit Heat Exchanger for primary power recovery
Fusion Engineering and Design. 2013;88(9-10):2427-2430   Crossref logo
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Multilayer printed circuit board for wire bonding
Metal Finishing. 1999;97(12):77-78   Crossref logo
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