 |
|
Ultrasonic Bonding Property of Aluminum Wire for Power Conversion Module of Automotive
Ji-Yeon Park, Chulmin Oh, Deok-Hee Won, Won Sik Hong
J Weld Join. 2018;36(3):57-64. Published online 2018 Jun 12 DOI: https://doi.org/10.5781/JWJ.2018.36.3.9
|
|
Citations to this article as recorded by
 Bonding Characteristics of Solder and Sinter Joints on Active-Metal-Brazing Substrates with Nano Sputtered Ag-Cu-Ti Brazing Filler Metal
Mi-Song Kim, Won Sik Hong, Yong-Mo Kim
Journal of Welding and Joining.2023; 41(6): 558. CrossRef Ultrasonic Bonding Interface Degradation Characteristics of Gold-Coated Silver Wire for Semiconductor Packaging
Mi-Song Kim, Won Sik Hong, Sang Yeop Kim, Sung Min Jeon, Jeong Tak Moon
Journal of Welding and Joining.2021; 39(4): 343. CrossRef Recent Progress in Transient Liquid Phase and Wire Bonding Technologies for Power Electronics
Hyejun Kang, Ashutosh Sharma, Jae Pil Jung
Metals.2020; 10(7): 934. CrossRef Pressureless Silver Sintering Property of SiC Device and ZTA AMB Substrate for Power Module
Mi-Song Kim, Chulmin Oh, Won Sik Hong
Journal of Welding and Joining.2019; 37(2): 15. CrossRef
|