Evaluation Method for Snap Cure Behavior of Non-conductive Paste for Flip Chip Bonding
Kyung-Eun Min, Jun-Sik Lee, So-Jeong Lee, Sung Yi, Jun-Ki Kim
Journal of Welding and Joining. 2015;33(5):41-46.   Published online 2015 Oct 30     DOI: https://doi.org/10.5781/JWJ.2015.33.5.41
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Reliability of an ultra-fine-pitch COF flip-chip package using non-conductive paste
Hae-Yeon Kim, Kyung-Eun Min, Jun-Sik Lee, So-Jeong Lee, Sung-Soo Lee, Jun-Ki Kim
Electronic Materials Letters.2016; 12(1): 48.     CrossRef