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- Development of SiC Composite Solder with Low CTE as Filling Material for Molten Metal TSV Filling
- Young-Ki Ko, Yong-Ho Ko, Jung-Hwan Bang, Chang-Woo Lee
- J Weld Join. 2014;32(3):282-287. Published online June 30, 2014
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- Technical Trend of TSV(Through Silicon Via) Filling for 3D Wafer Electric Packaging
- Young-Ki Ko, Yong-Ho Ko, Jung-Hwan Bang, Chang-Woo Lee
- J Weld Join. 2014;32(3):233-240. Published online June 30, 2014
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- High Speed TSV Filling Technology by using Molten Solder and Fabrication of Composite Solder as Filler Material
- Young-Ki Ko, Myung-Suk Kang, Sehoon Yoo, Chang-Woo Lee
- J Weld Join. 2012;30(3):21-25. Published online July 18, 2012
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- High Speed and Low Cost TSV Filling Technology by Using Molten Solder
- Young-Ki Ko, Min-Kuy Han, Sehoon Yoo, Chang-Woo Lee
- J Weld Join. 2011;29(3):14-18. Published online July 7, 2011
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