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83 Effect of Fine Silica Filler Addition on the CTE and Void Behavior of Non-conductive Paste for CoB Flip Chip Bonding   
Da-Eun Lim, Da-Hoon Jung, So-Jung Lee, Tae-Young Lee, Se-Hoon Yoo, Young-Bae Park, Jun-Ki Kim
Journal of Welding and Joining:83-88.  Publication Date (Web): August 6, 2018
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38 Thermal Aging Characteristics of Sn-xSb Solder for Automotive Power Module   
Junhyuk Son, Minkyung Kim, Dong-Yurl Yu, Young-Ho Ko, Jeong-Won Yoon, Chang-Woo Lee, Young-Bae Park, Junghwan Bang
Journal of Welding and Joining:38-47.  Publication Date (Web): September 26, 2017   Cited by 1
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26 Effect of BOE Wet Etching on Interfacial Characteristics of Cu-Cu Pattern Direct Bonds for 3D-IC Integrations
Jong-Myeong Park, Su-Hyeong Kim, SarahEunkyung Kim, Young-Bae Park
Journal of Welding and Joining:26-31.  Publication Date (Web): July 18, 2012
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57 Electrochemical Migration Characteristics of Sn-3.0Ag-0.5Cu Solder Alloy in NaBr and NaF Solutions
Ja-Young Jung, Eun-Jung Jang, Young-Ran Yoo, Shin-Bok Lee, Young-Sik Kim, Young-Chang Joo, Tai-Joo Chung, Kyu-Hwan Lee, Young-Bae Park
Journal of Welding and Joining:57-63.  Publication Date (Web): July 19, 2007
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