JWJ Search

38 Thermal Aging Characteristics of Sn-xSb Solder for Automotive Power Module   
Junhyuk Son, Minkyung Kim, Dong-Yurl Yu, Young-Ho Ko, Jeong-Won Yoon, Chang-Woo Lee, Young-Bae Park, Junghwan Bang
Journal of Welding and Joining:38-47.  Publication Date (Web): September 26, 2017
                  PDF Links
 
26 Effect of BOE Wet Etching on Interfacial Characteristics of Cu-Cu Pattern Direct Bonds for 3D-IC Integrations
Jong-Myeong Park, Su-Hyeong Kim, SarahEunkyung Kim, Young-Bae Park
Journal of Welding and Joining:26-31.  Publication Date (Web): July 18, 2012
PDF Links
 
57 Electrochemical Migration Characteristics of Sn-3.0Ag-0.5Cu Solder Alloy in NaBr and NaF Solutions
Ja-Young Jung, Eun-Jung Jang, Young-Ran Yoo, Shin-Bok Lee, Young-Sik Kim, Young-Chang Joo, Tai-Joo Chung, Kyu-Hwan Lee, Young-Bae Park
Journal of Welding and Joining:57-63.  Publication Date (Web): July 19, 2007
PDF Links
 
1 |
e-submission
endonote style file
JWJ
vol: Issue: Page:
e-sciencecentral
Register for e-submission
Register here to access the e-submission system of Journal of Welding and Joining for authors and reviewers.
Manuscript Submission
To submit a manuscript, please visit the Journal of Welding and Joining e-submission management system at http://submit.e-jwj.org, read the Instructions for Authors, and log into the Journal of Welding and Joining e-submission system. For assistance with manuscript submission, please contact: koweld@kwjs.or.kr.
Free archive
Anyone may access any past or current articles without logging in.
Editorial Office
The Korea Science and Technology Building, New B/D, Room 503
Teheran-ro 7-gil, 22(635-4, Yeoksam-Dong), Gangnam-gu, Seoul 06130, Korea
TEL : +82-2-538-6511    FAX : +82-2-538-6510   E-mail: koweld@kwjs.or.kr
Browse Articles |  Current Issue |  For Authors and Reviewers |  About
Copyright© by The Korean Welding and Joining Society. All right reserved.