JWJ Search

21 Intermetallic Compounds and Mechanical Property of Sn-Cu-xCr/Cu Solder Joint by Multiple reflows Conditions   
Dong-Yurl Yu, Junhyuk Son, Yong-Ho Ko, Chang-Woo Lee, Junghwan Bang
Journal of Welding and Joining:21-27.  Publication Date (Web): April 30, 2018
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7 Effects of High Temperature-moisture on Corrosion and Mechanical Properties for Sn-system Solder Joints   
Jeonga Kim, Yujin Park, Chul Min Oh, Won Sik Hong, Yong-Ho Ko, Sungdo Ahn, Namhyun Kang
Journal of Welding and Joining:7-14.  Publication Date (Web): June 30, 2017
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19 A study of joint properties of Sn-Cu-(X)Al(Si) middle-temperature solder for automotive electronics modules   
Dong-Yurl Yu, Yong-Ho Ko, Junghwan Bang, Chang-Woo Lee
Journal of Welding and Joining:19-24.  Publication Date (Web): June 30, 2015   Cited by 1
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282 Development of SiC Composite Solder with Low CTE as Filling Material for Molten Metal TSV Filling   
Young-Ki Ko, Yong-Ho Ko, Jung-Hwan Bang, Chang-Woo Lee
Journal of Welding and Joining:282-287.  Publication Date (Web): June 30, 2014
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233 Technical Trend of TSV(Through Silicon Via) Filling for 3D Wafer Electric Packaging   
Young-Ki Ko, Yong-Ho Ko, Jung-Hwan Bang, Chang-Woo Lee
Journal of Welding and Joining:233-240.  Publication Date (Web): June 30, 2014   Cited by 1
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54 Joint Property of Sn-Cu-Cr(Ca) Middle Temperature Solder for Automotive Electronic Module   
Junghwan Bang, Dong-Yurl Yu, Yong-Ho Ko, Jeonghan Kim, Chang-Woo Lee
Journal of Welding and Joining:54-58.  Publication Date (Web): November 5, 2013
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4 Study on Joint of Micro Solder Bump for Application of Flexible Electronics   
Yong-Ho Ko, Min-Su Kim, Taek-Soo Kim, Jung-Hwan Bang, Chang-Woo Lee
Journal of Welding and Joining:4-10.  Publication Date (Web): June 30, 2013   Cited by 1
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65 Interfacial Microstructure and Mechanical Property of Au Stud Bump Joined by Flip Chip Bonding with Sn-3.5Ag Solder
Young-Kyu Lee, Yong-Ho Ko, Sehoon Yoo, Chang-Woo Lee
Journal of Welding and Joining:65-70.  Publication Date (Web): January 20, 2012
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