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145 Effect of Underfill and Cornerfill on the 3-Point Bending Reliability of BGA Package Under Thermal Shock Test   
Kyung-Yeol Kim, Haksan Jeong, Sang-Woo Kim, Jae-Oh Bang, Seung-Boo Jung
Journal of Welding and Joining:145-151.  Publication Date (Web): April 22, 2020
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1 The Effect of Environmental Test on the Shear Strength of the Ultrasonic bonded Cu Terminal for Power Module   
Kyung-Yeol Kim, Kyung Deuk Min, Yongil Kim, Jeong-Won Yoon, Seung-Boo Jung
Journal of Welding and Joining:1-6.  Publication Date (Web): April 25, 2019   Cited by 1
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14 Microstructures and Drop Impact Test of SAC305, Sn58%Bi and Epoxy Sn58%Bi Solder Joint on the OSP Surface Finished PCB Substrate   
Kyung-Yeol Kim, Haksan Jeong, Woo-Ram Myung, Seung-Boo Jung
Journal of Welding and Joining:14-20.  Publication Date (Web): April 30, 2018
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