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477 Investigations of Material Properties of Underfill Material for Mechanical Reliability Improvement of Electronic Devices   
Byung-Seung Yim, Jin-Nam Kim, Jong-Min Kim
Journal of Welding and Joining:477-481.  Publication Date (Web): September 19, 2019
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76 Influence of Reductant Content within the Solderable Polymer Composite on the Coalescence and Wetting Behaviors of Low-Melting-Point Alloy Fillers   
Byung-Seung Yim, Jeong Il Lee, Jong-Min Kim
Journal of Welding and Joining:76-81.  Publication Date (Web): January 24, 2019
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15 Reliability Properties of Carbon Nanotube-filled Solderable Anisotropic Conductive Adhesives   
Byung-Seung Yim, Jeong Il Lee, Jong-Min Kim
Journal of Welding and Joining:15-20.  Publication Date (Web): June 30, 2017
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25 ACF COB Bonding Process using Thermosonic
Yong Song, Byung-Seung Yim, Jin-Sik Joung, Jong-Min Kim
Journal of Welding and Joining:25-28.  Publication Date (Web): March 4, 2011
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23 Electrically Conductive Adhesive using Low-melting-point Alloy and Bonding Process using Them
Byung-Seung Yim, Sung-Ho Jeon, Jong-Min Kim
Journal of Welding and Joining:23-31.  Publication Date (Web): July 6, 2009
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44 High-Density Electronic Packaging Technology using Anisotropic Conductive Adhesives
Jin-Woon Lee, SeongHyuk Lee, Jong-Min Kim
Journal of Welding and Joining:44-49.  Publication Date (Web): March 21, 2008
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45 Flow Characteristics and Filling Time Estimation for Underfill Process
Hyung-Sub Sim, Seong-Hyuk Lee, Jong-Min Kim, Young-Eui Shin
Journal of Welding and Joining:45-50.  Publication Date (Web): July 19, 2007
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31 Recent Advances on Conductive Adhesives in Electronic Packaging
Jong-Min Kim
Journal of Welding and Joining:31-36.  Publication Date (Web): May 17, 2007
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10 High Density Stacking Process and Reliability of Electronic Packaging
Young-Eui Shin, Jong-Min Kim, Young-Tark Kim, Joo-Seok Kim
Journal of Welding and Joining:10-16.  Publication Date (Web): July 18, 2006
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34 Evaluation of Pul Strengths and Fracture Modes of Solder Joints by Modified Ball Pull Testing with Protrusion Jaw
Hyoung-Il Kim, Sung-Won Han, Jong-Min Kim, Myung-Ki Choi, Young-Eui Shin
Journal of Welding and Joining:34-40.  Publication Date (Web): September 22, 2005
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41 Research for the Micro Packaging of Diamond Electron Emitter
Seung-Mock Lee, Jong-Min Kim
Journal of Welding and Joining:41-46.  Publication Date (Web): May 12, 2005
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18 Electrically Conductive Adhesive Bonding Technology for Microsystems Packaging
Jong-Min Kim, Seung-Mock Lee, Young-Eui Shin
Journal of Welding and Joining:18-22.  Publication Date (Web): May 12, 2005
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36 The Thermal Fatigue Analysis and Life Evaluation of Solder Joint for Flip Chip Package using Darveaux Model
Young-Eui Shin, Yeon-Sung Kim, Jong-Min Kim, Myun-Gi Choi
Journal of Welding and Joining:36-42.  Publication Date (Web): January 26, 2005
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25 Thermal Fatigue Characteristics of μBGA Solder Joints with Underfill
Young-Wook Koh, Jong-Min Kim, Jun-Hwan Lee, Young-Eui Shin
Journal of Welding and Joining:25-30.  Publication Date (Web): August 25, 2003
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