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482 Chip Sinter-Bonding Using Ag-Based Paste for Power Semiconductor Devices   
Na Yeon Lee, Jong-Hyun Lee, Chang-Yong Hyun
Journal of Welding and Joining:482-492.  Publication Date (Web): October 4, 2019
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7 High-speed Sintering of Ag-based Composite Ink by Nano-soldering   
Woo Lim Choi, Jong-Hyun Lee
Journal of Welding and Joining:7-13.  Publication Date (Web): April 11, 2018
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32 Epoxy solder paste and its applications   
Jong-Tae Moon, Yong-Sung Eom, Jong-Hyun Lee
Journal of Welding and Joining:32-39.  Publication Date (Web): June 30, 2015   Cited by 1
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27 TSV Interconnection Technology Using Solder Nanoparticles
Jong-Hyun Lee, Jong-Ho Yoon, Chang-Yong Hyun
Journal of Welding and Joining:27-34.  Publication Date (Web): July 7, 2011
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37 Standardization of Mechanical Test Method for Lead-Free Solder Paste - Shear Test Method for Chip Joint -
Jai-Hyun Park, Jong-Hyun Lee, Yong-Sik Ahn
Journal of Welding and Joining:37-42.  Publication Date (Web): May 17, 2007
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17 Necessity of Low Melting Temperature Pb-free Solder Alloy and Characteristics of Representative Alloys
Jong-Hyun Lee, Nam-Hyun Kang, Chang-Woo Lee, Jeong-Han Kim
Journal of Welding and Joining:17-28.  Publication Date (Web): July 18, 2006
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