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7 Epoxy Polymer Solder Pastes for Micro-Electronic Packaging Applications   
Ashutosh Sharma, Do Hyun Jung, Ju Seon Cheon, Jae Pil Jung
Journal of Welding and Joining:7-14.  Publication Date (Web): April 30, 2019
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241 Plasma Electrolytic Oxidation in Surface Modification of Metals for Electronics   
Mukesh Kumar Sharma, Youngjoo Jang, Jongmin Kim, Hyungtae Kim, Jae Pil Jung
Journal of Welding and Joining:241-247.  Publication Date (Web): June 30, 2014   Cited by 1
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11 Various Cu Filling Methods of TSV for Three Dimensional Packaging   
Myong-Hoon Roh, Jun-Hyeong Lee, Wonjoong Kim, Jae Pil Jung, Hyeong-Tea Kim
Journal of Welding and Joining:11-16.  Publication Date (Web): June 30, 2013
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15 Brazing Filler Metal and Process for Stainless Steel   
Sung Chul Hong, Sang Yoon Park, Do Hyun Jung, Joo Hee Oh, Jae Hoon Lee, Wonjoong Kim, Jae Pil Jung
Journal of Welding and Joining:15-20.  Publication Date (Web): December 23, 2012
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