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38 Thermal Aging Characteristics of Sn-xSb Solder for Automotive Power Module   
Junhyuk Son, Minkyung Kim, Dong-Yurl Yu, Young-Ho Ko, Jeong-Won Yoon, Chang-Woo Lee, Young-Bae Park, Junghwan Bang
Journal of Welding and Joining:38-47.  Publication Date (Web): September 26, 2017
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26 Lead-free Solder for Automotive Electronics and Reliability Evaluation of Solder Joint   
Jung-Hwan Bang, Dong-Yurl Yu, Young-Ho Ko, Jeong-Won Yoon, Chang-Woo Lee
Journal of Welding and Joining:26-34.  Publication Date (Web): February 29, 2016   Cited by 2
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19 A study of joint properties of Sn-Cu-(X)Al(Si) middle-temperature solder for automotive electronics modules   
Dong-Yurl Yu, Yong-Ho Ko, Junghwan Bang, Chang-Woo Lee
Journal of Welding and Joining:19-24.  Publication Date (Web): June 30, 2015   Cited by 1
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282 Development of SiC Composite Solder with Low CTE as Filling Material for Molten Metal TSV Filling   
Young-Ki Ko, Yong-Ho Ko, Jung-Hwan Bang, Chang-Woo Lee
Journal of Welding and Joining:282-287.  Publication Date (Web): June 30, 2014
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233 Technical Trend of TSV(Through Silicon Via) Filling for 3D Wafer Electric Packaging   
Young-Ki Ko, Yong-Ho Ko, Jung-Hwan Bang, Chang-Woo Lee
Journal of Welding and Joining:233-240.  Publication Date (Web): June 30, 2014
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54 Joint Property of Sn-Cu-Cr(Ca) Middle Temperature Solder for Automotive Electronic Module   
Junghwan Bang, Dong-Yurl Yu, Yong-Ho Ko, Jeonghan Kim, Chang-Woo Lee
Journal of Welding and Joining:54-58.  Publication Date (Web): November 5, 2013
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84 Fabrication and Reliability Test of Device Embedded Flexible Module   
Dae Gon Kim, Sung Taik Hong, Deok Heung Kim, Won Sik Hong, Chang-Woo Lee
Journal of Welding and Joining:84-88.  Publication Date (Web): June 30, 2013   Cited by 2
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4 Study on Joint of Micro Solder Bump for Application of Flexible Electronics   
Yong-Ho Ko, Min-Su Kim, Taek-Soo Kim, Jung-Hwan Bang, Chang-Woo Lee
Journal of Welding and Joining:4-10.  Publication Date (Web): June 30, 2013   Cited by 1
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6 Evaluation of Property and Reliability of Sn3.5Ag and Sn0.7Cu Pb-free Solder Joint by Complex Vibration for Application of Automobile Electric Module   
Young-Ho Ko, Jung-Hwan Bang, Jeong-Han Kim, Chang-Woo Lee
Journal of Welding and Joining:6-10.  Publication Date (Web): June 4, 2013
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1 Joint Reliability of Sn3.5Ag, Sn0.7Cu and Sn5.0Sb Pb-free Solder and Hybrids Joining Process for Application of Automobile Electric Module   
Myong-Suk Kang, Jung-Hwan Bang, Chang-Woo Lee
Journal of Welding and Joining:1-5.  Publication Date (Web): December 23, 2012
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1 Precise Joining Technology on Flexible Substrate by Using Micro-bumps
Min-Su Kim, Chang-Woo Lee
Journal of Welding and Joining:1-3.  Publication Date (Web): November 30, 2012
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21 High Speed TSV Filling Technology by using Molten Solder and Fabrication of Composite Solder as Filler Material
Young-Ki Ko, Myung-Suk Kang, Sehoon Yoo, Chang-Woo Lee
Journal of Welding and Joining:21-25.  Publication Date (Web): July 18, 2012
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65 Interfacial Microstructure and Mechanical Property of Au Stud Bump Joined by Flip Chip Bonding with Sn-3.5Ag Solder
Young-Kyu Lee, Yong-Ho Ko, Sehoon Yoo, Chang-Woo Lee
Journal of Welding and Joining:65-70.  Publication Date (Web): January 20, 2012
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35 Optimizing Mutiple Quality Characteristics of Through Silicon Via(TSV) Interface and Solder Joint Interface by Numerical Analysis-based Taguchi Method
Han-Sur Bang, Hee-Seon Bang, Se-Min Park, Chang-Woo Lee
Journal of Welding and Joining:35-38.  Publication Date (Web): July 7, 2011
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14 High Speed and Low Cost TSV Filling Technology by Using Molten Solder
Young-Ki Ko, Min-Kuy Han, Sehoon Yoo, Chang-Woo Lee
Journal of Welding and Joining:14-18.  Publication Date (Web): July 7, 2011
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17 Through Silicon Via Filling and Fine Pitch Joining Technology for 3D Electronic Package
Sehoon Yoo, Chang-Woo Lee
Journal of Welding and Joining:17-22.  Publication Date (Web): July 6, 2009
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51 Intermetallic Compounds Behavior at Laser Overlay Interface of Aluminum and Fe-based Powder
Namhyun Kang, Yeon-Gon Yoo, Chang-Woo Lee, Jeong-Han Kim
Journal of Welding and Joining:51-56.  Publication Date (Web): July 19, 2007
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17 Necessity of Low Melting Temperature Pb-free Solder Alloy and Characteristics of Representative Alloys
Jong-Hyun Lee, Nam-Hyun Kang, Chang-Woo Lee, Jeong-Han Kim
Journal of Welding and Joining:17-28.  Publication Date (Web): July 18, 2006
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88 [Research Papers] Development of Laser - Rotating Arc Hybrid Welding Process
Cheol-Hee Kim, Hyun-Byung Chae, Chang-Woo Lee, Jeong-Han Kim, Se-Hun Rhee
Journal of Welding and Joining:88-92.  Publication Date (Web): April 3, 2006
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7 [Technical Report] Preliminary Study on Arc Sensor in Laser - Rotating Arc Hybrid Welding
Cheol-Hee Kim, Jun-Ki Kim, Nam-Hyun Kang, Chang-Woo Lee
Journal of Welding and Joining:7-9.  Publication Date (Web): April 3, 2006
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