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76 Influence of Reductant Content within the Solderable Polymer Composite on the Coalescence and Wetting Behaviors of Low-Melting-Point Alloy Fillers   
Byung-Seung Yim, Jeong Il Lee, Jong-Min Kim
Journal of Welding and Joining:76-81.  Publication Date (Web): January 24, 2019
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15 Reliability Properties of Carbon Nanotube-filled Solderable Anisotropic Conductive Adhesives   
Byung-Seung Yim, Jeong Il Lee, Jong-Min Kim
Journal of Welding and Joining:15-20.  Publication Date (Web): June 30, 2017
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25 ACF COB Bonding Process using Thermosonic
Yong Song, Byung-Seung Yim, Jin-Sik Joung, Jong-Min Kim
Journal of Welding and Joining:25-28.  Publication Date (Web): March 4, 2011
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23 Electrically Conductive Adhesive using Low-melting-point Alloy and Bonding Process using Them
Byung-Seung Yim, Sung-Ho Jeon, Jong-Min Kim
Journal of Welding and Joining:23-31.  Publication Date (Web): July 6, 2009
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