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282 Development of SiC Composite Solder with Low CTE as Filling Material for Molten Metal TSV Filling   
Young-Ki Ko, Yong-Ho Ko, Jung-Hwan Bang, Chang-Woo Lee
Journal of Welding and Joining:282-287.  Publication Date (Web): June 30, 2014
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225 TSV Filling Technology using Cu Electrodeposition   
Se-Ho Kee, Ji-Oh Shin, Il-Ho Jung, Won-Joong Kim, Jae-Pil Jung
Journal of Welding and Joining:225-232.  Publication Date (Web): June 30, 2014   Cited by 1
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77 Fracture Mode Analysis with ISB Bonding Process Parameter for 3D Packaging   
Young-Kang Lee, Jae-Hak Lee, Jun-Yeob Song, Hyoung-Joon Kim
Journal of Welding and Joining:77-83.  Publication Date (Web): January 21, 2014
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46 Thermo-mechanical Reliability Analysis of Copper TSV
Sung-Hoon Choa, Cha-Gyu Song
Journal of Welding and Joining:46-51.  Publication Date (Web): March 4, 2011
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