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Optimization of FC-CSP and MLCC Soldering Process Using Type 7 Solder Paste
Hye-Min Lee, Mi-Song Kim, Myeongin Kim, Won Sik Hong
J Weld Join. 2022;40(2):165-174.   Published online April 21, 2022
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2032163
Flip Chip - Chip Scale Package Bonding Technology with Type 7 Solder Paste Printing
Mi-Song Kim, Won Sik Hong, Myeongin Kim
J Weld Join. 2021;39(4):359-367.   Published online August 23, 2021
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2032015
Epoxy Polymer Solder Pastes for Micro-Electronic Packaging Applications
Ashutosh Sharma, Do Hyun Jung, Ju Seon Cheon, Jae Pil Jung
J Weld Join. 2019;37(2):7-14.   Published online April 30, 2019
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Epoxy solder paste and its applications
Jong-Tae Moon, Yong-Sung Eom, Jong-Hyun Lee
J Weld Join. 2015;33(3):32-39.   Published online June 30, 2015
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Interfacial Reaction and Joint Strength of the Sn-58Bi Solder Paste with ENIG Surface Finished Substrate
Hyun-Pil Shin, Byung-Wook Ahn, Jee-Hyuk Ahn et al.
J Weld Join. 2012;30(5):64-69.   Published online November 30, 2012
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