Advanced Search  
 JWJ Search

89 Growth Behavior of Intermetallic Compounds in Various Solder Joints Induced by Electromigration   
Sujong Kim, Wonsik Hong, Hyunbin Nam, Namhyun Kang
Journal of Welding and Joining:89-102.  Publication Date (Web): February 26, 2021
PDF Links
 
576 Recent Low Temperature Solder of SnBi and Its Bonding Characteristics   
Hyejun Kang, Bumgyu Baek, Jae Pil Jung
Journal of Welding and Joining:576-583.  Publication Date (Web): December 3, 2020
                  PDF Links
 
7 Epoxy Polymer Solder Pastes for Micro-Electronic Packaging Applications   
Ashutosh Sharma, Do Hyun Jung, Ju Seon Cheon, Jae Pil Jung
Journal of Welding and Joining:7-14.  Publication Date (Web): April 30, 2019   Cited by 2
                  PDF Links
 
52 Effect of Thin ENEPIG Plating Thickness on Interfacial Reaction and Brittle Fracture Rate of Sn-3.0Ag-0.5Cu Solder Joints   
Jong-Hoon Back, Sehoon Yoo, Deok-Gon Han, Seung-Boo Jung, Jeong-Won Yoon
Journal of Welding and Joining:52-60.  Publication Date (Web): September 17, 2018
                  PDF Links
 
78 A Study on the Electrochemical Corrosion Property of Sn-xSb Solder Alloy   
Junhyuk Son, Dong-Yurl Yu, Yong-Ho Ko, Junghwan Bang
Journal of Welding and Joining:78-82.  Publication Date (Web): June 19, 2018
                  PDF Links
 
7 High-speed Sintering of Ag-based Composite Ink by Nano-soldering   
Woo Lim Choi, Jong-Hyun Lee
Journal of Welding and Joining:7-13.  Publication Date (Web): April 11, 2018
                  PDF Links
 
51 Interfacial reactions and mechanical strength of Sn-3.0Ag-0.5Cu/0.1㎛-Ni thin ENEPIG solder joint   
Jong-Hoon Back, Sehoon Yoo, Deok-Gon Han, Seung-Boo Jung, Jeong-Won Yoon
Journal of Welding and Joining:51-58.  Publication Date (Web): December 4, 2017   Cited by 2
                  PDF Links
 
38 Thermal Aging Characteristics of Sn-xSb Solder for Automotive Power Module   
Junhyuk Son, Minkyung Kim, Dong-Yurl Yu, Young-Ho Ko, Jeong-Won Yoon, Chang-Woo Lee, Young-Bae Park, Junghwan Bang
Journal of Welding and Joining:38-47.  Publication Date (Web): September 26, 2017   Cited by 5
                  PDF Links
 
21 Cu Corrosion Test Method for Lead-Free Solders   
Mi-Song Kim, Won Sik Hong, Chul Min Oh, Keun-Soo Kim
Journal of Welding and Joining:21-27.  Publication Date (Web): June 30, 2017
                  PDF Links
 
7 Effects of High Temperature-moisture on Corrosion and Mechanical Properties for Sn-system Solder Joints   
Jeonga Kim, Yujin Park, Chul Min Oh, Won Sik Hong, Yong-Ho Ko, Sungdo Ahn, Namhyun Kang
Journal of Welding and Joining:7-14.  Publication Date (Web): June 30, 2017
                  PDF Links
 
26 Lead-free Solder for Automotive Electronics and Reliability Evaluation of Solder Joint   
Jung-Hwan Bang, Dong-Yurl Yu, Young-Ho Ko, Jeong-Won Yoon, Chang-Woo Lee
Journal of Welding and Joining:26-34.  Publication Date (Web): February 29, 2016   Cited by 5
                  PDF Links
 
32 Epoxy solder paste and its applications   
Jong-Tae Moon, Yong-Sung Eom, Jong-Hyun Lee
Journal of Welding and Joining:32-39.  Publication Date (Web): June 30, 2015   Cited by 1
PDF Links
 
25 Validation of sequence test method of Pb-free solder joint for automotive electronics   
A Young Kim, Chul Min Oh, Won Sik Hong
Journal of Welding and Joining:25-31.  Publication Date (Web): June 30, 2015
PDF Links
 
19 A study of joint properties of Sn-Cu-(X)Al(Si) middle-temperature solder for automotive electronics modules   
Dong-Yurl Yu, Yong-Ho Ko, Junghwan Bang, Chang-Woo Lee
Journal of Welding and Joining:19-24.  Publication Date (Web): June 30, 2015   Cited by 1
PDF Links
 
611 Degradation Behavior of Eutectic and Pb-free Solder Plated Ribbon in Crystalline Silicon Photovoltaic Module   
Ju-Hee Kim, A Yong Kim, Nochang Park, Jeong Won Ha, Sang Guon Lee, Won Sik Hong
Journal of Welding and Joining:611-617.  Publication Date (Web): December 31, 2014
PDF Links
 
288 Degradation Characteristics of Eutectic and Pb-free Solder Joint of Electronics mounted for Automotive Engine   
A Young Kim, Won Sik Hong
Journal of Welding and Joining:288-294.  Publication Date (Web): June 30, 2014   Cited by 1
PDF Links
 
282 Development of SiC Composite Solder with Low CTE as Filling Material for Molten Metal TSV Filling   
Young-Ki Ko, Yong-Ho Ko, Jung-Hwan Bang, Chang-Woo Lee
Journal of Welding and Joining:282-287.  Publication Date (Web): June 30, 2014
PDF Links
 
267 Impact of External Temperature Environment on Large FCBGA Sn-Ag-Cu Solder Interconnect Board Level Mechanical Shock Performance   
Tae-Kyu Lee
Journal of Welding and Joining:267-273.  Publication Date (Web): June 30, 2014
PDF Links
 
54 Joint Property of Sn-Cu-Cr(Ca) Middle Temperature Solder for Automotive Electronic Module   
Junghwan Bang, Dong-Yurl Yu, Yong-Ho Ko, Jeonghan Kim, Chang-Woo Lee
Journal of Welding and Joining:54-58.  Publication Date (Web): November 5, 2013   Cited by 1
PDF Links
 
22 Degradation Behavior of Solder Joint and Implementation Technology for Lead-free Automotive Electronics   
Won Sik Hong, Chul Min Oh
Journal of Welding and Joining:22-30.  Publication Date (Web): June 30, 2013   Cited by 5
PDF Links
 
4 Study on Joint of Micro Solder Bump for Application of Flexible Electronics   
Yong-Ho Ko, Min-Su Kim, Taek-Soo Kim, Jung-Hwan Bang, Chang-Woo Lee
Journal of Welding and Joining:4-10.  Publication Date (Web): June 30, 2013   Cited by 2
PDF Links
 
64 Interfacial Reaction and Joint Strength of the Sn-58Bi Solder Paste with ENIG Surface Finished Substrate
Hyun-Pil Shin, Byung-Wook Ahn, Jee-Hyuk Ahn, Jong-Gun Lee, Kwang-Seok Kim, Duk-Hyun Kim, Seung-Boo Jung
Journal of Welding and Joining:64-69.  Publication Date (Web): November 30, 2012
PDF Links
 
38 Active Metal Brazing Applied to Joining of ZrO2-Ti Alloy
Se-Ho Kee, Sang-Yoon Park, Jae-Pil Jung, Won-Joong Kim
Journal of Welding and Joining:38-43.  Publication Date (Web): July 18, 2012
PDF Links
 
65 Behavior of Vibration Fracture for Sn-Ag-Cu-X Solders by Soldering
Sanghun Jin, Namhyun Kang, Kyung-mox Cho, Changwoo Lee, Wonsik Hong
Journal of Welding and Joining:65-69.  Publication Date (Web): May 16, 2012
PDF Links
 
95 Flux residue effect on the electrochemical migration of Sn-3.0Ag-0.5Cu
Junghwan. Bang, Changwoo. Lee
Journal of Welding and Joining:95-98.  Publication Date (Web): November 22, 2011
PDF Links
 
99 Improvement of Solder Joint Strength in SAC 305 Solder Ball to ENIG Substrate Using LF Hydrogen Radical Treatment
Ah-reum Lee, Seung-jae Jo, Jai-hyun Park, Chung-yun Kang
Journal of Welding and Joining:99-106.  Publication Date (Web): March 4, 2011
PDF Links
 
41 Estimation of Mechanical Properties of Sn-xAg-0.5Cu Lead-free Solder by Tensile Test
Jong-Seol Jeong, Ki-Hoon Shin, Jong-Hyeong Kim
Journal of Welding and Joining:41-45.  Publication Date (Web): March 4, 2011
PDF Links
 
85 Research of Optimum Reflow Process Condition for 0402 Electric Parts
Junghwan Bang, Sehyung Lee, Yueseon Shin, Jeonghan Kim, Changwoo Lee
Journal of Welding and Joining:85-89.  Publication Date (Web): March 12, 2009
PDF Links
 
43 Characteristics of Sn-1.7Bi-0.7Cu-0.6In Lead-free Solder
Ji-Ho Park, Hee-Yul Lee, Ji-Heon Jhun, Chu-Seon Cheon, Jae-Pil Jung
Journal of Welding and Joining:43-48.  Publication Date (Web): November 12, 2008
PDF Links
 
30 A Study on the Optimization of IR Laser Flip-chip Bonding Process Using Taguchi Methods
Chun-Sam Song, Hyun-Sik Ji, Joohan Kim, Jong-Hyeong Kim, Hyo-Sok Ahn
Journal of Welding and Joining:30-36.  Publication Date (Web): July 31, 2008
PDF Links
 
1 | 2 |
e-submission
endonote style file
JWJ
vol: Issue: Page:
e-sciencecentral
Register for e-submission
Register here to access the e-submission system of Journal of Welding and Joining for authors and reviewers.
Manuscript Submission
To submit a manuscript, please visit the Journal of Welding and Joining e-submission management system at http://submit.e-jwj.org, read the Instructions for Authors, and log into the Journal of Welding and Joining e-submission system. For assistance with manuscript submission, please contact: koweld@kwjs.or.kr.
Free archive
Anyone may access any past or current articles without logging in.
Editorial Office
#304, San-Jeong Building,
23, Gukhoe-daero 66-gil, Yeongdeungpo-gu, Seoul 07237, Korea
TEL : +82-2-538-6511    FAX : +82-2-538-6510   E-mail: koweld@kwjs.or.kr
Browse Articles |  Current Issue |  For Authors and Reviewers |  About
Copyright© by The Korean Welding and Joining Society. All right reserved.           Developed in M2PI