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Bonding Characteristics of Solder and Sinter Joints on Active-Metal-Brazing Substrates with Nano Sputtered Ag-Cu-Ti Brazing Filler Metal
Mi-Song Kim, Won Sik Hong, Yong-Mo Kim
J Weld Join. 2023;41(6):558-565.   Published online December 31, 2023
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Property Evaluation and Fabrication of WC-Co-Si3N4 Hard Materials by a Rapid Sintering Process
Jeong-Han Lee, Hyun-Kuk Park
J Weld Join. 2021;39(6):625-631.   Published online December 6, 2021
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Evaluation of WC-Co-Cr3C2 Hard Materials for Friction Stir Welding Tool Application via Spark Plasma Sintering Process
Jeong-Han Lee, Hyun-Kuk Park
J Weld Join. 2021;39(5):513-519.   Published online September 7, 2021
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Terminal Sinter-Bonding Using Silver Paste for Aluminum Nitride Heater
Yun-Chan Kim, Dong-Yurl Yu, Junhyuk Son et al.
J Weld Join. 2021;39(4):384-391.   Published online August 27, 2021
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Effect of Temperature in Post-Treatment Process of Zirconia 3D Printing
Minho Lee, HanMyeong Do, JaeHyeon Park et al.
J Weld Join. 2021;39(1):59-66.   Published online January 21, 2021
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Effect of Sintering Conditions on Microstructure and Mechanical Strength of Cu Micro-Particle Sintered Joints for High-Power Semiconductor Module Applications
Byung-Suk Lee, Jong-Hoon Back, Jeong-Won Yoon
J Weld Join. 2019;37(2):26-34.   Published online April 22, 2019
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2032010
Pressureless Silver Sintering Property of SiC Device and ZTA AMB Substrate for Power Module
Mi-Song Kim, Chulmin Oh, Won Sik Hong
J Weld Join. 2019;37(2):15-20.   Published online April 19, 2019
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2031934
High-speed Sintering of Ag-based Composite Ink by Nano-soldering
Woo Lim Choi, Jong-Hyun Lee
J Weld Join. 2018;36(2):7-13.   Published online April 11, 2018
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2031604
Laser Additive Manufacturing Technology Review
Myun Joong Hwang, Jungho Cho
J Weld Join. 2014;32(4):353-357.   Published online August 30, 2014
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2031640
Mechanical Properties and Fabrication of WC-Co Hard Materials by Rapid Sintering Method for Friction Stir Welding Tool Application
Hyun-Kuk Park, Hee-Jun Youn, Jung-Han Ryu, Jun-Ho Jang, In-Jin Shon, Ik-Hyun Oh
J Weld Join. 2012;30(6):92-97.   Published online December 23, 2012
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Interfacial Microstructures between Ag Wiring Layers and Various Substrates
Keun-Soo Kim, K. Suganuma, Seok-Hwan Huh
J Weld Join. 2011;29(5):90-94.   Published online November 22, 2011
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