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477 Investigations of Material Properties of Underfill Material for Mechanical Reliability Improvement of Electronic Devices   
Byung-Seung Yim, Jin-Nam Kim, Jong-Min Kim
Journal of Welding and Joining:477-481.  Publication Date (Web): September 19, 2019
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1 The Effect of Environmental Test on the Shear Strength of the Ultrasonic bonded Cu Terminal for Power Module   
Kyung-Yeol Kim, Kyung Deuk Min, Yongil Kim, Jeong-Won Yoon, Seung-Boo Jung
Journal of Welding and Joining:1-6.  Publication Date (Web): April 25, 2019   Cited by 1
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15 Reliability Properties of Carbon Nanotube-filled Solderable Anisotropic Conductive Adhesives   
Byung-Seung Yim, Jeong Il Lee, Jong-Min Kim
Journal of Welding and Joining:15-20.  Publication Date (Web): June 30, 2017
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26 Lead-free Solder for Automotive Electronics and Reliability Evaluation of Solder Joint   
Jung-Hwan Bang, Dong-Yurl Yu, Young-Ho Ko, Jeong-Won Yoon, Chang-Woo Lee
Journal of Welding and Joining:26-34.  Publication Date (Web): February 29, 2016   Cited by 5
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32 Epoxy solder paste and its applications   
Jong-Tae Moon, Yong-Sung Eom, Jong-Hyun Lee
Journal of Welding and Joining:32-39.  Publication Date (Web): June 30, 2015   Cited by 1
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25 Validation of sequence test method of Pb-free solder joint for automotive electronics   
A Young Kim, Chul Min Oh, Won Sik Hong
Journal of Welding and Joining:25-31.  Publication Date (Web): June 30, 2015
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267 Impact of External Temperature Environment on Large FCBGA Sn-Ag-Cu Solder Interconnect Board Level Mechanical Shock Performance   
Tae-Kyu Lee
Journal of Welding and Joining:267-273.  Publication Date (Web): June 30, 2014
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84 Fabrication and Reliability Test of Device Embedded Flexible Module   
Dae Gon Kim, Sung Taik Hong, Deok Heung Kim, Won Sik Hong, Chang-Woo Lee
Journal of Welding and Joining:84-88.  Publication Date (Web): June 30, 2013   Cited by 2
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22 Degradation Behavior of Solder Joint and Implementation Technology for Lead-free Automotive Electronics   
Won Sik Hong, Chul Min Oh
Journal of Welding and Joining:22-30.  Publication Date (Web): June 30, 2013   Cited by 5
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4 Study on Joint of Micro Solder Bump for Application of Flexible Electronics   
Yong-Ho Ko, Min-Su Kim, Taek-Soo Kim, Jung-Hwan Bang, Chang-Woo Lee
Journal of Welding and Joining:4-10.  Publication Date (Web): June 30, 2013   Cited by 2
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46 Thermo-mechanical Reliability Analysis of Copper TSV
Sung-Hoon Choa, Cha-Gyu Song
Journal of Welding and Joining:46-51.  Publication Date (Web): March 4, 2011
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77 Reliability Assessment and Accelerated Life Prediction of Gas Welded Joint in the Rail Road Car Body (1. Plug and Ring Type)
SeungYeb Baek
Journal of Welding and Joining:77-85.  Publication Date (Web): March 10, 2010
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