Advanced Search  
 JWJ Search

482 Chip Sinter-Bonding Using Ag-Based Paste for Power Semiconductor Devices   
Na Yeon Lee, Jong-Hyun Lee, Chang-Yong Hyun
Journal of Welding and Joining:482-492.  Publication Date (Web): October 4, 2019
                  PDF Links
 
510 Fabrication of the Cu-STS-Cu Clad Metal for High Strength Electric Device Lead Frame and Thermal Stability on Their Physical Properties   
Il-Gwon Kim, Moon-Eui Son, Young-Sung Kim
Journal of Welding and Joining:510-516.  Publication Date (Web): October 30, 2014
PDF Links
 
1 |
e-submission
endonote style file
JWJ
vol: Issue: Page:
e-sciencecentral
Register for e-submission
Register here to access the e-submission system of Journal of Welding and Joining for authors and reviewers.
Manuscript Submission
To submit a manuscript, please visit the Journal of Welding and Joining e-submission management system at http://submit.e-jwj.org, read the Instructions for Authors, and log into the Journal of Welding and Joining e-submission system. For assistance with manuscript submission, please contact: koweld@kwjs.or.kr.
Free archive
Anyone may access any past or current articles without logging in.
Editorial Office
The Korea Science and Technology Building, New B/D, Room 503
Teheran-ro 7-gil, 22(635-4, Yeoksam-Dong), Gangnam-gu, Seoul 06130, Korea
TEL : +82-2-538-6511    FAX : +82-2-538-6510   E-mail: koweld@kwjs.or.kr
Browse Articles |  Current Issue |  For Authors and Reviewers |  About
Copyright© by The Korean Welding and Joining Society. All right reserved.