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38 Thermal Aging Characteristics of Sn-xSb Solder for Automotive Power Module   
Junhyuk Son, Minkyung Kim, Dong-Yurl Yu, Young-Ho Ko, Jeong-Won Yoon, Chang-Woo Lee, Young-Bae Park, Junghwan Bang
Journal of Welding and Joining:38-47.  Publication Date (Web): September 26, 2017   Cited by 1
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25 Validation of sequence test method of Pb-free solder joint for automotive electronics   
A Young Kim, Chul Min Oh, Won Sik Hong
Journal of Welding and Joining:25-31.  Publication Date (Web): June 30, 2015
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38 Active Metal Brazing Applied to Joining of ZrO2-Ti Alloy
Se-Ho Kee, Sang-Yoon Park, Jae-Pil Jung, Won-Joong Kim
Journal of Welding and Joining:38-43.  Publication Date (Web): July 18, 2012
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65 Behavior of Vibration Fracture for Sn-Ag-Cu-X Solders by Soldering
Sanghun Jin, Namhyun Kang, Kyung-mox Cho, Changwoo Lee, Wonsik Hong
Journal of Welding and Joining:65-69.  Publication Date (Web): May 16, 2012
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95 Flux residue effect on the electrochemical migration of Sn-3.0Ag-0.5Cu
Junghwan. Bang, Changwoo. Lee
Journal of Welding and Joining:95-98.  Publication Date (Web): November 22, 2011
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85 Research of Optimum Reflow Process Condition for 0402 Electric Parts
Junghwan Bang, Sehyung Lee, Yueseon Shin, Jeonghan Kim, Changwoo Lee
Journal of Welding and Joining:85-89.  Publication Date (Web): March 12, 2009
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