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1 Lifetime Predictions of Printed Circuit Boards under Biased HAST   
Seok-Hwan Huh
Journal of Welding and Joining:1-6.  Publication Date (Web): April 6, 2018
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47 Chlorine effect on ion migration for PCBs under temperature-humidity bias test   
Seok-Hwan Huh, An-Seob Shin
Journal of Welding and Joining:47-53.  Publication Date (Web): June 30, 2015
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52 Study of Metal(Au) Bump for Transverse Ultrasonic Bonding
Myeong-Gu Ji, Chun-Sam Song, Joo-Hyun Kim, Jong-Hyeong Kim
Journal of Welding and Joining:52-58.  Publication Date (Web): March 4, 2011
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