Advanced Search  
 JWJ Search

366 Effect of Ar Plasma Treatment for Surface of Insert Metal on Property of TLP Bonding Joint for Power Module   
Seungju Baek, Dong-Yurl Yu, Jun-Hyuk Son, Junghwan Bang, Jungsoo Kim, Min-Su Kim, Han-Bo-Ram Lee, Yong-Ho Ko
Journal of Welding and Joining:366-373.  Publication Date (Web): August 24, 2020
                  PDF Links
 
51 Interfacial reactions and mechanical strength of Sn-3.0Ag-0.5Cu/0.1㎛-Ni thin ENEPIG solder joint   
Jong-Hoon Back, Sehoon Yoo, Deok-Gon Han, Seung-Boo Jung, Jeong-Won Yoon
Journal of Welding and Joining:51-58.  Publication Date (Web): December 4, 2017   Cited by 2
                  PDF Links
 
65 Interfacial Microstructure and Mechanical Property of Au Stud Bump Joined by Flip Chip Bonding with Sn-3.5Ag Solder
Young-Kyu Lee, Yong-Ho Ko, Sehoon Yoo, Chang-Woo Lee
Journal of Welding and Joining:65-70.  Publication Date (Web): January 20, 2012
PDF Links
 
1 |
e-submission
endonote style file
JWJ
vol: Issue: Page:
e-sciencecentral
Register for e-submission
Register here to access the e-submission system of Journal of Welding and Joining for authors and reviewers.
Manuscript Submission
To submit a manuscript, please visit the Journal of Welding and Joining e-submission management system at http://submit.e-jwj.org, read the Instructions for Authors, and log into the Journal of Welding and Joining e-submission system. For assistance with manuscript submission, please contact: koweld@kwjs.or.kr.
Free archive
Anyone may access any past or current articles without logging in.
Editorial Office
#304, San-Jeong Building,
23, Gukhoe-daero 66-gil, Yeongdeungpo-gu, Seoul 07237, Korea
TEL : +82-2-538-6511    FAX : +82-2-538-6510   E-mail: koweld@kwjs.or.kr
Browse Articles |  Current Issue |  For Authors and Reviewers |  About
Copyright© by The Korean Welding and Joining Society. All right reserved.