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83 Effect of Fine Silica Filler Addition on the CTE and Void Behavior of Non-conductive Paste for CoB Flip Chip Bonding   
Da-Eun Lim, Da-Hoon Jung, So-Jung Lee, Tae-Young Lee, Se-Hoon Yoo, Young-Bae Park, Jun-Ki Kim
Journal of Welding and Joining:83-88.  Publication Date (Web): August 6, 2018
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