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Effect of Fine Silica Filler Addition on the CTE and Void Behavior of Non-conductive Paste for CoB Flip Chip Bonding
Da-Eun Lim, Da-Hoon Jung, So-Jung Lee et al.
J Weld Join. 2018;36(4):83-88.   Published online August 6, 2018
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Evaluation Method for Snap Cure Behavior of Non-conductive Paste for Flip Chip Bonding
Kyung-Eun Min, Jun-Sik Lee, So-Jeong Lee, Sung Yi, Jun-Ki Kim
J Weld Join. 2015;33(5):41-46.   Published online October 30, 2015
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Interfacial Microstructure and Mechanical Property of Au Stud Bump Joined by Flip Chip Bonding with Sn-3.5Ag Solder
Young-Kyu Lee, Yong-Ho Ko, Sehoon Yoo, Chang-Woo Lee
J Weld Join. 2011;29(6):65-70.   Published online January 20, 2012
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