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83 Effect of Fine Silica Filler Addition on the CTE and Void Behavior of Non-conductive Paste for CoB Flip Chip Bonding   
Da-Eun Lim, Da-Hoon Jung, So-Jung Lee, Tae-Young Lee, Se-Hoon Yoo, Young-Bae Park, Jun-Ki Kim
Journal of Welding and Joining:83-88.  Publication Date (Web): August 6, 2018
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41 Evaluation Method for Snap Cure Behavior of Non-conductive Paste for Flip Chip Bonding   
Kyung-Eun Min, Jun-Sik Lee, So-Jeong Lee, Sung Yi, Jun-Ki Kim
Journal of Welding and Joining:41-46.  Publication Date (Web): October 30, 2015   Cited by 1
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65 Interfacial Microstructure and Mechanical Property of Au Stud Bump Joined by Flip Chip Bonding with Sn-3.5Ag Solder
Young-Kyu Lee, Yong-Ho Ko, Sehoon Yoo, Chang-Woo Lee
Journal of Welding and Joining:65-70.  Publication Date (Web): January 20, 2012
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