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7 Epoxy Polymer Solder Pastes for Micro-Electronic Packaging Applications   
Ashutosh Sharma, Do Hyun Jung, Ju Seon Cheon, Jae Pil Jung
Journal of Welding and Joining:7-14.  Publication Date (Web): April 30, 2019
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14 Microstructures and Drop Impact Test of SAC305, Sn58%Bi and Epoxy Sn58%Bi Solder Joint on the OSP Surface Finished PCB Substrate   
Kyung-Yeol Kim, Haksan Jeong, Woo-Ram Myung, Seung-Boo Jung
Journal of Welding and Joining:14-20.  Publication Date (Web): April 30, 2018
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44 The Effect of Nano Functionalized Block Copolymer Addition on the Joint Strength of Structural Epoxy Adhesive for Car Body Assembly   
Hye-rim Lee, So-jeong Lee, Chang-young Lim, Jong-dock Seo, Mok-soon Kim, Jun-ki Kim
Journal of Welding and Joining:44-49.  Publication Date (Web): August 31, 2015
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32 Epoxy solder paste and its applications   
Jong-Tae Moon, Yong-Sung Eom, Jong-Hyun Lee
Journal of Welding and Joining:32-39.  Publication Date (Web): June 30, 2015
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71 The Effect of Zirconate Addition on the Joint Properties of Epoxy Adhesive for Car Body Assembly   
Eun-taek Jeung, Hye-rim Lee, So-jeong Lee, Chang-young Lim, Jong-dock Seo, Mok-soon Kim, Jun-ki Kim
Journal of Welding and Joining:71-76.  Publication Date (Web): November 5, 2013
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54 Effect of Curing Agent on the Curing Behavior and Joint Strength of Epoxy Adhesive
Min-Su Kim, Hae-Yeon Kim, Se-Hoon Yoo, Jong-Hoon Kim, Jun-Ki Kim
Journal of Welding and Joining:54-60.  Publication Date (Web): September 12, 2011
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