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26 Effect of Sintering Conditions on Microstructure and Mechanical Strength of Cu Micro-Particle Sintered Joints for High-Power Semiconductor Module Applications   
Byung-Suk Lee, Jong-Hoon Back, Jeong-Won Yoon
Journal of Welding and Joining:26-34.  Publication Date (Web): April 22, 2019
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7 Epoxy Polymer Solder Pastes for Micro-Electronic Packaging Applications   
Ashutosh Sharma, Do Hyun Jung, Ju Seon Cheon, Jae Pil Jung
Journal of Welding and Joining:7-14.  Publication Date (Web): April 30, 2019
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32 Epoxy solder paste and its applications   
Jong-Tae Moon, Yong-Sung Eom, Jong-Hyun Lee
Journal of Welding and Joining:32-39.  Publication Date (Web): June 30, 2015   Cited by 1
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25 Validation of sequence test method of Pb-free solder joint for automotive electronics   
A Young Kim, Chul Min Oh, Won Sik Hong
Journal of Welding and Joining:25-31.  Publication Date (Web): June 30, 2015
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248 Recent Progress in Flexible/Wearable Electronics   
Seok Hee Kang, Suck Won Hong
Journal of Welding and Joining:248-256.  Publication Date (Web): June 30, 2014   Cited by 1
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241 Plasma Electrolytic Oxidation in Surface Modification of Metals for Electronics   
Mukesh Kumar Sharma, Youngjoo Jang, Jongmin Kim, Hyungtae Kim, Jae Pil Jung
Journal of Welding and Joining:241-247.  Publication Date (Web): June 30, 2014   Cited by 1
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15 Adhesion Measurement Methods for Thin Films in Microelectronics
Taek-Soo Kim
Journal of Welding and Joining:15-20.  Publication Date (Web): July 18, 2012
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