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57 Development of Printed Circuit Heat Exchanger for Hydrogen Station using Diffusion Bonding   
Jeong Kil Kim, Deog Nam Shim, Chil Yeong Seon, Ki Hoon Yang, Hae Ji Park, Dong Jin Kim
Journal of Welding and Joining:57-64.  Publication Date (Web): September 19, 2017
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384 Effect of Bonding Temperature and Bonding Pressure on Deformation and Tensile Properties of Diffusion Bonded Joint of STS304 Compact Heat Exchanger   
Ae-Jeong Jeon, Tae-Jin Yoon, Sang-Ho Kim, Hyeon-Jun Kim, Chung-Yun Kang
Journal of Welding and Joining:384-392.  Publication Date (Web): August 30, 2014
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76 Effect of Bonding Condition on the Tensile Properties of Diffusion Bonded Haynes230   
Gil-Mo Kang, Ae-Jeong Jeon, Hong-Kyu Kim, Sung-Suk Hong, Chung-Yun Kang
Journal of Welding and Joining:76-83.  Publication Date (Web): June 30, 2013   Cited by 1
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