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8 Parametric Study of Self-Piercing Riveting for CFRP-Aluminum Dissimilar Joint   
Nam-Ki Jeon, Sehun Rhee, Dong-Hyuck Kam
Journal of Welding and Joining:8-17.  Publication Date (Web): June 4, 2018
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75 Microstructure and Hardness of Surface Melting Hardened Zone of Mold Steel, SM45C using Yb:YAG Disk Laser   
Kwang-Hyeon Lee, Seong-Won Choi, Tae-Jin Yoon, Chung-Yun Kang
Journal of Welding and Joining:75-81.  Publication Date (Web): February 29, 2016   Cited by 2
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53 Microstructure and Hardness of Yb:YAG Disc Laser Surface Overlap Melted Cold Die Steel, STD11   
Kwang-Hyeon Lee, Seong-Won Choi, Jung Gil Yun, Myeong-Hwan Oh, Byung Min Kim, Chung-Yun Kang
Journal of Welding and Joining:53-60.  Publication Date (Web): October 30, 2015   Cited by 2
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41 Evaluation Method for Snap Cure Behavior of Non-conductive Paste for Flip Chip Bonding   
Kyung-Eun Min, Jun-Sik Lee, So-Jeong Lee, Sung Yi, Jun-Ki Kim
Journal of Welding and Joining:41-46.  Publication Date (Web): October 30, 2015   Cited by 1
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77 Fracture Mode Analysis with ISB Bonding Process Parameter for 3D Packaging   
Young-Kang Lee, Jae-Hak Lee, Jun-Yeob Song, Hyoung-Joon Kim
Journal of Welding and Joining:77-83.  Publication Date (Web): January 21, 2014
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4 Study on Joint of Micro Solder Bump for Application of Flexible Electronics   
Yong-Ho Ko, Min-Su Kim, Taek-Soo Kim, Jung-Hwan Bang, Chang-Woo Lee
Journal of Welding and Joining:4-10.  Publication Date (Web): June 30, 2013   Cited by 1
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