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15 Pressureless Silver Sintering Property of SiC Device and ZTA AMB Substrate for Power Module   
Mi-Song Kim, Chulmin Oh, Won Sik Hong
Journal of Welding and Joining:15-20.  Publication Date (Web): April 19, 2019
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57 Ultrasonic Bonding Property of Aluminum Wire for Power Conversion Module of Automotive   
Ji-Yeon Park, Chulmin Oh, Deok-Hee Won, Won Sik Hong
Journal of Welding and Joining:57-64.  Publication Date (Web): June 12, 2018   Cited by 1
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14 Microstructures and Drop Impact Test of SAC305, Sn58%Bi and Epoxy Sn58%Bi Solder Joint on the OSP Surface Finished PCB Substrate   
Kyung-Yeol Kim, Haksan Jeong, Woo-Ram Myung, Seung-Boo Jung
Journal of Welding and Joining:14-20.  Publication Date (Web): April 30, 2018
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65 Interfacial Microstructure and Mechanical Property of Au Stud Bump Joined by Flip Chip Bonding with Sn-3.5Ag Solder
Young-Kyu Lee, Yong-Ho Ko, Sehoon Yoo, Chang-Woo Lee
Journal of Welding and Joining:65-70.  Publication Date (Web): January 20, 2012
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45 The Bonding Strength Characteristic of the Filler Metal Powder on the TLP Bonded Region of Superalloy GTD-111DS
In-Seok Oh, Gil-Moo Kim, Byeong-Shik Moon
Journal of Welding and Joining:45-50.  Publication Date (Web): December 3, 2007
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